BGA IC rework system

Category: Industrial Automation Control System

Specifications:

Product Introduction

A customized auxiliary system designed for IC rework, including chip de‑soldering and re‑soldering processes.

Product Features

• Temperature range from room temperature up to 400°C

• Temperature and heating duration adjustable through the user interface (UI)

• Supports 110V or 220V input voltage

• Step‑wise temperature ramp‑up control

• Infrared (IR) heating method

• No airflow interference with the heat source

• Cooling fan automatically activated after heating to accelerate cooldown

• Built‑in CCD for monitoring IC pin alignment

Applications & Case Studies

• Used for BGA chip de‑soldering and re‑soldering operations

Features: